Opis: Intelligent Integrated Systems

This book gives a state-of-the-art overview by internationally recognized researchers of the architectures of breakthrough devices required for future intelligent integrated systems. The first section highlights Advanced Silicon-Based CMOS Technologies. New device and functional architectures are reviewed in chapters on Tunneling Field-Effect Transistors and 3-D monolithic Integration, which the alternative materials could possibly use in the future. The way we can augment silicon technologies is illustrated by the co-integration of new types of devices, such as molecular and resistive spintronics-based memories and smart sensors, using nanoscale features co-integrated with silicon CMOS or above it.Introduction Intelligent Integrated Systems Forward to Zero Variability and Zero Power! S. Deleonibus Advanced Silicon-Based CMOS Technologies From Planar to Trigate and Nanowires Fully Depleted Transistors, Francois Andrieu, Olivier Weber, Marie-Anne Jaud, Thomas Ernst, and Olivier Faynot Schottky Source/Drain MOSFETs, Emmanuel Dubois, Guilhem Larrieu, Nicolas Reckinger, Xiaohui Tang, Jean-Pierre Raskin, Maud Vinet, and Louis Hutin Advances in Silicon-On-Diamond Technology, Jean-Paul Mazellier, Julie Widiez, Marc Rabarot, Francois Andrieu, Samuel Saada, Mathieu Lions, Philippe Bergonzo, and Simon Deleonibus GeOI, SiGeOI and New Devices Architectures, Cyrille Le Royer, Emmanuel Augendre, Louis Hutin, Frederic Mayer, William Van den Daele 3D Monolithic Integration, Maud Vinet, Perrine Batude, Shashikanth Bobba III-V Quantum-Well FETs, Suman Datta Carbon Integrated Electronics, Hong Li, Yasin Khatami, Deblina Sarkar, Jiahao Kang, Chuan Xu, Wei Liu, and Kaustav Banerjee New Paths to Augmented Silicon CMOS Technologies Tunneling Field-Effect Transistors - Challenges and Perspectives, Joachim Knoch Molecular Memories, Julien Buckley, Tiziana Pro, Venera Aiello, Micael Charbonneau, and Barbara De Salvo Resistive Memories, Blanka Magyari-Kope and Yoshio Nishi High frequency vibrating nanowire, Laurent Duraffourg and Thomas Ernst Spintronics, Guillaume Prenat, Ursula Ebels, Gregory Di Pendina, Ricardo Sousa, and Bernard Dieny Smart Multiphysics Sensors, Masayoshi Esashi 3D Integration and Wafer Level Packaging, Gilles Poupon

Szczegóły: Intelligent Integrated Systems

Tytuł: Intelligent Integrated Systems
Producent: Pan American Health Organisation
ISBN: 9789814411424
Rok produkcji: 2014
Ilość stron: 516
Oprawa: Twarda
Waga: 0.85 kg

Recenzje: Intelligent Integrated Systems