Opis: Design and Modeling for 3D IC's and Interposers - Madhavan Swaminathan, Ki Jin Han

3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.System Integration and Modeling Concepts; Modeling of Cylindrical Interconnections; Electrical Modeling of Through Silicon Vias; Electrical Performance and Signal Integrity; Power Integrity, Return Path Discontinuities and Thermal Management.

Szczegóły: Design and Modeling for 3D IC's and Interposers - Madhavan Swaminathan, Ki Jin Han

Tytuł: Design and Modeling for 3D IC's and Interposers
Autor: Madhavan Swaminathan, Ki Jin Han
Producent: World Scientific Publishing Co Ltd
ISBN: 9789814508599
Rok produkcji: 2013
Ilość stron: 380
Oprawa: Twarda
Waga: 0.66 kg

Recenzje: Design and Modeling for 3D IC's and Interposers - Madhavan Swaminathan, Ki Jin Han